Chotsukira cha Alumina cha mainchesi 12 cha 300mm Wafer Processing
Chikwama cha vacuum cha St.Cera cha mainchesi 12 chimapangidwa bwino kwambiri kuchokera ku alumina ya 99.8% yoyera bwino (Al₂O₃) kuti chigwiritsidwe ntchito ndi wafer wa 300mm. Chikwamacho chili ndi malo opindika bwino (m'lifupi mwa groove 0.5–1.0 mm, pitch 2–3 mm) kuti chitsimikizire kufalikira kwa vacuum mofanana m'mimba mwake wonse wa 300mm. Kusalala kumakhala mkati mwa 5 μm, zomwe zimathandiza kuti wafer ikhale yolimba popanda kupindika panthawi yocheka, kupukuta kumbuyo, ndi kuyang'aniridwa. Mphamvu yayikulu yopindika (361 MPa) ndi kuuma (16 GPa) kwa chinthucho zimatsimikizira kukhazikika kwa nthawi yayitali ngakhale pansi pa vacuum cycles mobwerezabwereza.
Mafotokozedwe (kutengera 99.8% Al₂O₃):
| Katundu | Mtengo |
| M'mimba mwake | 300 mm (mainchi 12) |
| Zinthu Zofunika | 99.8% Alumina (Minyanga ya Njovu) |
| Kuchulukana | 3.93 g/cm³ |
| Mphamvu Yosinthasintha | 361 MPa |
| Kuuma kwa Vickers | 16 GPa |
| Kusalala (kupitirira 300mm) | ≤5 μm |
| Kukula kwa Groove | 0.5–1.0 mm |
| Kutentha Kwambiri Kogwira Ntchito | 800°C |
| Mphamvu ya Dielectric | 15×10⁶ V/m |
Mapulogalamu:
Kudula ndi kulemba ma wafer a 300mm
Kupera kumbuyo kwa wafer (chothandizira wafer woonda)
Kuyang'anira ndi kufufuza maso
Zomangira/zochotsa ma bonding kwakanthawi
Kupanga:
CNC yaphwanyidwa ndikulumikizana mpaka itasalala, yolumikizidwa ndi mawilo a diamondi, yotsukidwa ndi ultrasound, ndikuyikidwa mu chipinda chotsukira cha Class 100. Chuck iliyonse imayesedwa 100% kuti ione ngati yasalala (laser interferometer) ndi kuya kwa groove (profilometer).
Ubwino:
Kupanga tinthu tating'onoting'ono kochepa (≤0.05 tinthu/cm²)
Mankhwala osagwira ntchito ku zosungunulira ndi ma acid
Malo otetezeka a ESD (kukana >10¹³ Ω·cm)
Mapangidwe a mabowo otayira mpweya ndi madoko akumbuyo amapezeka.
